PHYSICAL CHARACTERIZATION



The main actions of this service are addressed towards:

  • Reverse engineering characterisation
  • Physical characterisation with electric methodology (Spreading Resistance)
  • Package of microelectronic devices


Person responsible/contact:
Salvador Hidalgo (salvador.hidalgo@cnm.es)

 

EQUIPMENT AVALIABLE

Reverse engineering. Physical characterisation
  • Spreading Resistance measurement system
  • Scanning Electron Microscope (SEM)
  • Automatic polishing machine with multisample head
  • Automatic polishing machine with two heads suitable for microsections
  • Polishing machine for Spreading Resistance samples preparation
  • Diamond saw
  • 2 optical microscopes (with micromeasurement equipment)
  • Photomicroscope
  • Plasma equipment for plastic and layer decapping
  • Laser level technique for mechanical stress measurement
Packaging

  • Automatic saw for dicing
  • 2 wedge bonding machines
  • SMD, flip-chip and die bonding equipment

 


 
Contact: Dt@cnm.es